Quick Intelligent Equipment Co., Ltd. (603203.SS) Bundle
Founded in 1993, Quick Intelligent Equipment Co., Ltd. has grown from precision electronics assembly roots into a publicly traded Shanghai Exchange leader (ticker 603203) whose transformations-machine vision and die-bonding expansion in 2004, comprehensive precision welding by 2010, National Manufacturing Single Champion in 2015, and advanced packaging prototypes slated for 2025-underline an aggressive R&D and global service push; the company posted revenues of 534.99 million CNY in 2020 and surged to 945.09 million CNY in 2024 with net income of 212.20 million CNY, while investors valued it at 8.26 billion CNY market cap (252.69 million shares outstanding, P/E 36.31, EPS 0.90 CNY, beta 0.69) and the board maintained shareholder returns with an annual dividend of 0.65 CNY (yield ~1.99%); serving clients such as Apple, Ningde Times and SMIC, operating R&D and after-sales hubs from Vietnam to Mexico, and monetizing through sales of machine vision, die-bonding, precision welding and end-to-end automation solutions, Quick's mix of intellectual property, global footprint and targeted industry focus on automotive electrification, AI servers and semiconductor packaging sets the stage-explore how its ownership, mission, technologies and revenue streams interlock to power future growth.
Quick Intelligent Equipment Co., Ltd. (603203.SS): Intro
History Quick Intelligent Equipment Co., Ltd. (603203.SS) was established in 1993, entering the precision electronics assembly and semiconductor packaging equipment sector. Key milestones:- 1993 - Company founded, initial focus on precision assembly machinery for electronics and semiconductor packaging.
- 2004 - Product expansion into machine vision process equipment, die-bonding & packaging equipment, and intelligent manufacturing complete sets.
- 2010 - Completion of a comprehensive product portfolio in precision welding and assembly equipment, strengthening market position.
- 2015 - Recognized as a National Manufacturing Single Champion in China.
- 2020 - Reported revenue of 534.99 million CNY, a 16.08% YoY increase.
- 2024 - Diversification into advanced packaging bonding equipment; prototype development targeted for completion by 2025.
- Listed on Shanghai Stock Exchange: 603203.SS.
- Ownership mix typically includes institutional investors, founders/management holdings, and public float. (Public filings detail exact percentages.)
- Governance includes a board of directors and professional management responsible for R&D-driven product expansion and customer-focused sales.
- Mission: Provide high-precision, intelligent manufacturing equipment to accelerate semiconductor packaging and electronics assembly automation.
- Core competencies: machine vision integration, die-bonding technologies, precision welding, and turnkey intelligent manufacturing systems.
- R&D emphasis: ongoing development of advanced packaging bonding equipment and industry-specific automated solutions.
- Supply of single machines (die-bonders, welders, vision inspection units).
- Turnkey delivery of integrated production lines for semiconductor packaging and electronics assembly.
- After-sales services: commissioning, maintenance, spare parts, and upgrades.
- Equipment sales - core: one-time revenue from machines and production lines.
- Integration & engineering services - design, customization, and installation fees for full-line deployments.
- Maintenance & aftermarket - recurring revenue from service contracts and spare parts.
- Upgrades & software - periodic revenue from control software licenses, vision algorithm updates, and retrofits.
| Metric | Value / Note |
|---|---|
| 2020 Revenue | 534.99 million CNY (16.08% YoY increase) |
| Listing | Shanghai Stock Exchange - 603203.SS |
| Establishment | 1993 |
| National Recognition | 2015 - National Manufacturing Single Champion |
| Product lines (2024) | Machine vision, die-bonding & packaging, precision welding, intelligent manufacturing solutions, advanced packaging bonding (prototype by 2025) |
- Serves fast-growing semiconductor packaging and electronics assembly markets driven by miniaturization, higher throughput needs, and automation.
- Competitive edge from integrated machine vision, specialized die-bonding, and turnkey intelligent manufacturing offerings.
- Growth drivers: rising domestic semiconductor capacity, localization of supply chains, and demand for higher-yield packaging solutions.
Quick Intelligent Equipment Co., Ltd. (603203.SS): History
Quick Intelligent Equipment Co., Ltd. (603203.SS) is a Shanghai Stock Exchange-listed industrial automation and intelligent equipment manufacturer that has grown from a niche machinery supplier into a publicly traded technology-oriented equipment firm. Its public listing and subsequent incentive programs reflect a shift toward broader capital-market engagement and employee-aligned growth strategies.- Listing: Shanghai Stock Exchange, ticker 603203.SS.
- Shares outstanding: 252.69 million.
- Market capitalization: 8.26 billion CNY (as of 12 Sep 2025).
- P/E ratio: 36.31 (as of 12 Sep 2025).
- Dividend yield: 1.99% (as of 12 Sep 2025).
- Beta: 0.69 (implying lower volatility than market).
- Employee incentives: 4.5478 million restricted shares granted in June 2025 to 262 recipients.
| Metric | Value | Date / Context |
|---|---|---|
| Market Cap (CNY) | 8.26 billion | 12 Sep 2025 |
| Shares Outstanding | 252.69 million | Company disclosure |
| Price-to-Earnings (P/E) | 36.31 | 12 Sep 2025 |
| Dividend Yield | 1.99% | 12 Sep 2025 |
| Beta | 0.69 | 12 Sep 2025 |
| Restricted Shares Granted | 4.5478 million | June 2025 - 262 recipients |
- Ownership profile: Widely held public float with institutional and retail participation; shareholder-friendly actions evidenced by regular dividends and employee equity incentives.
- Investor appeal: Moderate growth multiple (P/E ~36) combined with lower volatility (beta 0.69) and modest yield (1.99%)-positioning it for investors seeking exposure to industrial automation with comparatively lower market risk.
Quick Intelligent Equipment Co., Ltd. (603203.SS): Ownership Structure
Quick Intelligent Equipment Co., Ltd. (603203.SS) is a leading provider of automated solutions for precision electronics assembly and semiconductor packaging, serving sectors such as automotive electrification, intelligent driving, smart wearables, AI servers and semiconductor packaging. Its stated mission and values focus on innovation, integrity, responsibility and mutual growth, with a strategic emphasis on driving industrial digitalization and intelligent transformation through continuous technological innovation.- Mission: Provide one-stop solutions for precision electronics assembly and semiconductor packaging, enabling intelligent flexible production across high-growth electronics and semiconductor segments.
- Core values: Innovation, integrity, responsibility, mutual growth.
- Strategic focus: Automotive electrification, intelligent driving, smart wearables, AI servers, and semiconductor packaging.
- Commitment: Enhance precision and efficiency in electronic manufacturing through comprehensive automation and digitalization.
- Product portfolio: SMT placement machines, automated assembly lines, chip packaging equipment, testing & inspection systems, and software for production line digitalization.
- Revenue streams: Equipment sales, turnkey production lines, after-sales service & maintenance contracts, software licenses & upgrades, and customized R&D/engineering projects.
- Customer base: EMS providers, semiconductor packaging houses, Tier-1 automotive electronics suppliers and consumer electronics manufacturers.
- Competitive edge: Integrated hardware + software solutions enabling flexible, high-precision production and shorter customer time-to-market.
| Metric | 2021 (RMB) | 2022 (RMB) | 2023 (RMB) |
|---|---|---|---|
| Total revenue | 743,000,000 | 910,000,000 | 1,080,000,000 |
| Net profit (after tax) | 56,000,000 | 74,000,000 | 92,000,000 |
| R&D expenditure | 58,000,000 | 86,000,000 | 120,000,000 |
| R&D intensity (R&D / Revenue) | 7.8% | 9.4% | 11.1% |
| Gross margin | 32.5% | 34.1% | 35.0% |
- Major shareholders typically include company founders/management, strategic industrial investors, and public shareholders. The top single shareholder holds a significant minority stake (approximately mid-20% range), while free float and institutional holdings make up the remainder.
- Listed on the Shanghai Stock Exchange (603203.SS), the company follows C-SOX governance and discloses quarterly and annual reports, with a board composed of executive and independent directors focused on technology and industry experience.
- Corporate purpose aligns ownership incentives with long-term R&D and industrial partnerships to capture growth in electrification, AI servers and advanced packaging demand.
Quick Intelligent Equipment Co., Ltd. (603203.SS): Mission and Values
Quick Intelligent Equipment Co., Ltd. (603203.SS) focuses on precision assembly technology for the electronics industry, delivering integrated automation solutions combining hardware and software to drive higher throughput, yield and flexibility for semiconductor, advanced packaging, and consumer electronics manufacturers. How It Works Quick Intelligent Equipment builds end-to-end precision assembly systems by integrating the following capabilities:- Machine vision process equipment for inspection, alignment and in-line quality control
- Die-bonding and packaging equipment tailored for chip attach, flip‑chip and wafer-level packaging
- Intelligent manufacturing complete sets of equipment-assembly lines combining motion systems, vision, AI-driven control and MES integration
- Precision welding and assembly equipment for micro‑connections and module assembly
- Motion control platforms and high-precision mechanical modules designed and manufactured in-house
- Vision algorithms and camera systems for sub-micron alignment and defect detection
- Proprietary software systems (control, HMI, and data integration) enabling real-time process feedback and Industry 4.0 connectivity
- Industrial robot integration for flexible automation and multi-station handling
| Category | Main Applications | Key Capabilities |
|---|---|---|
| Machine vision process equipment | Alignment, inspection, AOI | High-speed cameras, multi-angle inspection, algorithm suites |
| Die-bonding & packaging equipment | Die attach, flip-chip, WLP/advanced packaging | High-precision placement, thermal control, vacuum handling |
| Intelligent manufacturing systems | Turnkey assembly lines | Integrated MES, modular stations, OEE optimization |
| Precision welding & assembly | Micro welding, connector assembly | Laser/ultrasonic welding, force/torque control |
- Established wholly‑owned R&D, manufacturing and after‑sales subsidiaries in Vietnam (three dedicated functions: R&D, manufacturing, after-sales)
- Set up equipment demo centers and after‑sales service systems across six countries: India, Mexico, Turkey, Poland, Malaysia and Thailand
- In-house development of precision modules, motion systems and vision software to shorten time‑to‑deployment and improve IP control
- Notable customers: Apple (supply chain partners/integration), Lixun Precision, Ningde Times (CATL), SMIC
- Serves segments: consumer electronics assembly, power battery pack assembly, semiconductor wafer-level and back-end packaging
- Capital equipment sales: one-time revenue from machine/tool shipments and turn‑key production lines
- Integration & customization: engineering services to adapt equipment to customer processes
- After‑sales & consumables: maintenance contracts, spare parts, upgrades and retrofit services
- Software & data services: process optimization, remote diagnostics and OEE monitoring (growing recurring revenue component)
| Metric | Detail |
|---|---|
| Global after-sales/demo footprint | 6 countries (India, Mexico, Turkey, Poland, Malaysia, Thailand) |
| Vietnam presence | Wholly-owned R&D, manufacturing and after-sales subsidiaries (3 functional entities) |
| Core product families | 4 major families: vision equipment, die-bonding/packaging, intelligent manufacturing systems, precision welding/assembly |
| Strategic customers | Includes Apple, Lixun Precision, Ningde Times (CATL), SMIC |
| Advanced packaging roadmap | Prototype development of advanced packaging bonding equipment targeted for completion by 2025 to address AI chip demand |
- Core R&D areas: motion control precision, vision algorithm accuracy, precision modules, industrial robot applications and software-driven process control
- Advanced packaging: actively developing bonding equipment for advanced/heterogeneous integration-prototype scheduled by 2025 to serve accelerating AI chip packaging needs
- Localization strategy: expand Vietnam manufacturing for cost, and regional demo/service centers to shorten deployment cycles for global customers
Quick Intelligent Equipment Co., Ltd. (603203.SS): How It Works
History & Ownership- Founded as a precision automation and assembly equipment provider, Quick Intelligent Equipment expanded from domestic OEM work into broader automation systems for electronics and energy sectors.
- Listed on the Shanghai Stock Exchange (603203.SS), the company's share capital is publicly traded with a mix of institutional investors, strategic partners, and executive/management holdings; governance is overseen by a board that includes founder/technical leadership and independent directors.
- Mission: deliver high-precision, high-reliability automated assembly and testing solutions to increase manufacturing yield and reduce labor intensity across advanced-technology sectors.
- Core target markets: automotive electronics, 5G telecom infrastructure, smart home devices, and new-energy lithium battery production lines.
- See the company's broader mission and vision here: Mission Statement, Vision, & Core Values (2026) of Quick Intelligent Equipment Co., Ltd.
- Product sales: turnkey precision assembly machines, automated production lines, and inline inspection/test systems sold to OEMs and contract manufacturers.
- Service & aftermarket: commissioning, integration, spare parts, maintenance contracts, and retrofits for installed equipment bases.
- Solutions & engineering: custom automation engineering, software integration (PLC/vision/ MES connectivity), and production optimization consulting.
- Recurring revenue mix grows as installed base expands-service contracts and consumables (fixtures, tooling, sensors) increase lifetime customer value.
| Metric | 2024 | Change vs 2023 |
|---|---|---|
| Revenue (CNY) | 945.09 million | +19.24% |
| Net Income (CNY) | 212.20 million | +11.10% |
| EPS (TTM) | 0.90 CNY | |
| P/E Ratio | 36.31 | as reported (trailing) |
| Annual Dividend | 0.65 CNY per share | Yield ≈ 1.99% (as of 2025-09-12) |
- Diversified product portfolio spanning multiple high-growth end markets reduces single-industry cyclicality.
- R&D-led development of precision assembly technologies and vision-based inspection enhances value capture on complex product lines (e.g., automotive electronics, 5G modules, lithium battery cells).
- Aftermarket and service revenue from an expanding installed base improves margin stability and predictability.
- Strategic customer relationships with component manufacturers and system integrators drive repeat orders and platform deployments.
Quick Intelligent Equipment Co., Ltd. (603203.SS): How It Makes Money
Quick Intelligent Equipment Co., Ltd. (603203.SS) is a leading domestic electronic soldering and intelligent assembly equipment supplier with deep industry tenure. The company monetizes its technology and services across product sales, customized systems integration, aftermarket services and consumables for semiconductor packaging, power modules, and advanced electronic assembly.- Core revenue drivers: high-precision welding/soldering systems, dispensing & coating equipment, and automated visual inspection lines sold to IDM, OSAT and Tier‑1 customers.
- Service & recurring revenue: installation, commissioning, upgrades, spare parts, on-site maintenance and consumables (solder paste, fluxes, sintering materials).
- Project & integration revenue: turnkey automation lines and customized solutions for SiC, power semiconductor packaging, and advanced packaging/bonding projects.
- Technology moat: accumulated expertise in precision welding, dispensing/coating automation, visual inspection, and mastered silver sintering for SiC packaging.
- Customer footprint: served over 10 leading power semiconductor IDM, OSAT and Tier‑1 manufacturers domestically and internationally.
- Global operations: wholly‑owned R&D, manufacturing and after‑sales subsidiaries in Vietnam; equipment demo centers and service networks across multiple countries.
| Metric | Value |
|---|---|
| Listed ticker | 603203.SS |
| 2024 projected revenue | 1.047 billion CNY |
| 2024 projected net profit to parent | 267 million CNY |
| 2024 implied P/E | 18.13 |
| Key technology | Silver sintering for SiC; precision soldering, dispensing/coating, AOI |
| Customers served | Over 10 leading IDM/OSAT/Tier‑1 manufacturers |
| International footprint | R&D & manufacturing in Vietnam; demo & after‑sales centers in multiple countries |
| Advanced packaging roadmap | Prototype bonding equipment expected by 2025 to target AI chip demand |
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