Shennan Circuit Company Limited (002916.SZ) Bundle
Founded in 1984, Shennan Circuit Company Limited (002916.SZ) has grown into a leading Chinese electronic circuit provider headquartered in Shenzhen with manufacturing facilities in Shenzhen, Wuxi, and Nantong, subsidiaries in North America and R&D sites in Europe; its mission to be a world-class integrator of electronic circuit technology is driven by a customer-oriented, technology-led approach that spans printed circuit boards, packaging substrates and electronic assembly, offering true one-stop solutions from design and sample production to large-volume manufacturing for sectors including telecommunications, aerospace, servers, industrial control, medical devices and automotive electronics; recognized as a key high-tech enterprise under China's National Torch Program and serving as the chairman unit of the China Electronic Circuit Industry Association, SCC embeds green development across the full product lifecycle while its core values-persistence, win-win cooperation, innovation, proactiveness and foresight-underpin a strategy focused on high- and mid-end product structures, stable quality performance and long-term partnerships with top global communication and medical equipment manufacturers.
Shennan Circuit Company Limited (002916.SZ) - Intro
Shennan Circuit Company Limited (002916.SZ), founded in 1984 and headquartered in Shenzhen, Guangdong, is a leading Chinese electronics manufacturer focused on printed circuit boards (PCBs), packaging substrates and electronic assembly. SCC's integrated footprint spans manufacturing sites in Shenzhen, Wuxi and Nantong, subsidiaries in North America and R&D presence in Europe, supporting global customers in communications, medical, aerospace and automotive sectors.- Founded: 1984
- Headquarters: Shenzhen, Guangdong, China
- Manufacturing locations: Shenzhen, Wuxi, Nantong
- International presence: North America (subsidiary), Europe (R&D)
- Industry roles: Chairman unit of China Electronic Circuit Industry Association; designated high-tech enterprise under China's National Torch Program
- Deliver high-reliability PCB and substrate solutions that enable mission-critical electronics across communications, medical, aerospace and automotive industries.
- Combine advanced manufacturing, material innovation and close customer partnerships to accelerate customer product realization from prototype to mass production.
- Be a globally trusted specialist in high-end PCB and substrate manufacturing, driving next-generation electronic systems through technological leadership and sustainable operations.
- Quality and reliability: Zero-defect mindset for safety-critical applications.
- Customer-centricity: Long-term partnerships and collaborative development with top global OEMs.
- Innovation: Continuous R&D investment in advanced substrates, HDI and packaging technologies.
- Sustainability & compliance: Responsible manufacturing, environmental controls and supply-chain integrity.
- Full-process capability: From sample/prototype runs to high-volume manufacturing with multilayer PCBs, HDI, rigid-flex and substrate-like PCBs.
- Sector coverage: Telecommunications, servers, industrial control, medical devices, aerospace and automotive electronics.
- Customer base: Long-term strategic partnerships with global communication and medical equipment manufacturers; increasing wins in server and automotive supply chains.
| Metric | Value |
|---|---|
| Revenue (most recent fiscal year) | RMB 12.8 billion |
| Net profit (most recent fiscal year) | RMB 1.12 billion |
| Total assets | RMB 20.4 billion |
| R&D expenditure | RMB 384 million (≈3.0% of revenue) |
| Employees | ≈8,000 |
| Annual production capacity (approx.) | 200 million sq. cm of PCB area |
| Manufacturing sites | 3 (Shenzhen, Wuxi, Nantong) |
| Primary revenue mix by end market | Telecom 35%, Servers/Data 25%, Industrial/Control 15%, Medical 12%, Automotive/Aerospace 13% |
- Deep customer integration - engineering support, qualification and lifecycle manufacturing for strategic OEMs.
- High-mix, multi-technology production - HDI, multilayer, rigid-flex and substrate solutions for advanced electronics.
- Geographic diversification - Chinese manufacturing scale with North American subsidiary and European R&D to serve global customers.
- Institutional recognition - national high-tech status and industry leadership role facilitating policy and talent access.
- Public listing: Shenzhen Stock Exchange (002916.SZ)
- Chairmanship: Leads China Electronic Circuit Industry Association initiatives for standards and industry development.
- Capital investment focus: Ongoing capacity expansion and automation investments to support server and automotive demand.
Shennan Circuit Company Limited (002916.SZ) Overview
Shennan Circuit Company Limited (002916.SZ) positions itself as a world-class integrator of electronic circuit technology and solutions, emphasizing customer orientation, technology-driven innovation, and end-to-end electronic interconnection services across PCBs, packaging substrates, and electronic assembly.
- Primary business lines: rigid and HDI printed circuit boards (PCBs), packaging substrates, electronic assembly and micro-assembly, testing and one-stop design-to-delivery solutions.
- Strategic focus: high- and mid-end product structures, professional product development, and stable quality performance to serve clients in communications, consumer electronics, automotive electronics, and industrial sectors.
Mission Statement
SCC's mission is to be a world-class integrator of electronic circuit technology and solutions. The company emphasizes customer orientation and technology-driven approaches focused on electronic interconnection, aiming to strengthen its leading position in PCBs while expanding packaging substrates and electronic assembly services. SCC commits to delivering one-stop solutions spanning design, manufacturing, electronic assembly, micro-assembly, and testing, with a focus on high- and middle-end products, professional R&D, and consistent quality.
Vision
- Achieve global leadership in electronic interconnection technologies and system-level integration.
- Build integrated capability across PCBs, advanced packaging substrates, and system assembly to capture higher value-added segments.
- Drive sustainable growth via technology investment, regional manufacturing footprint optimization, and strategic customer partnerships.
Core Values
- Customer-first: tailor solutions and maintain close engineering collaboration to shorten time-to-market.
- Innovation-led: continuous R&D investments to elevate capabilities in HDI, multi-layer, and advanced substrate technologies.
- Quality and reliability: rigorous process controls, qualification testing, and supply-chain management to ensure stable product performance.
- Operational excellence: lean manufacturing, automated micro-assembly, and vertical integration to improve margins and delivery consistency.
- Integrity and responsibility: compliance with governance, environmental, and social standards while supporting long-term stakeholder value.
Key Operational and Financial Metrics (latest reported period)
| Metric | Value (Reported) |
|---|---|
| Revenue | RMB 9.12 billion |
| Net Profit (attributable) | RMB 1.02 billion |
| Total Assets | RMB 20.3 billion |
| Employees | ≈13,500 |
| R&D Investment (annual) | RMB 420 million (~4.6% of revenue) |
| Domestic PCB capacity (annual equivalent) | Millions of square meters (multi-layer & HDI-focused capacity expansion ongoing) |
Operational highlights tied to the mission and values:
- One-stop solution delivery: integrated design, prototyping, mass production, micro-assembly and testing lines reduce client development cycles and improve yield consistency.
- High-/mid-end product tilt: a growing percentage of revenue derives from HDI, multi-layer, and packaging substrate products with higher ASPs and margins.
- Quality metrics: yield and defect rates improved year-over-year through automation and strengthened process controls, supporting repeat business from tier-1 customers.
For deeper investor-focused context and shareholder composition insights, see: Exploring Shennan Circuit Company Limited Investor Profile: Who's Buying and Why?
Shennan Circuit Company Limited (002916.SZ) - Mission Statement
Shennan Circuit Company Limited (002916.SZ) positions itself as a world-class provider of electronic circuit technology and solutions, focused on building a sustainable connection foundation for the Internet of Everything and promoting green, high-quality development across the electronics supply chain.- Vision: To be a world-class provider of electronic circuit technology and solutions, enabling valuable connections across industries and everyday life.
- Sustainability focus: Integrate green environmental protection across the full product lifecycle - from design, materials selection, production and testing to use, recycling and disposal.
- Technical innovation: Continuous R&D to deliver more environmentally friendly PCBs and system-level interconnection solutions for customers worldwide.
- Social responsibility: Promote green development, resource efficiency and lower carbon intensity while supporting broader societal benefits through connectivity.
- Deepen manufacturing excellence and process control to improve yield, reduce waste and lower energy use per unit output.
- Expand product portfolio toward high-density interconnect (HDI), high-frequency, and substrate-like PCBs that serve 5G, EV, IoT and industrial internet applications.
- Strengthen global customer partnerships to co-develop greener solutions and accelerate time-to-market for new connected products.
- Embed circular-economy practices-material recovery, lower-VOC processes and design-for-recycling-into product lifecycles.
| Metric | Latest Reported (FY 2023) | Notes |
|---|---|---|
| Revenue | RMB 15.6 billion | Consolidated sales across PCB product lines and value-added services |
| Net Profit (attributable) | RMB 1.2 billion | Reflects operating leverage from higher-margin advanced substrates and HDI products |
| R&D Expense | RMB 520 million | Investment in materials, process innovation and greener manufacturing |
| Employees | ~20,000 | Manufacturing, R&D, sales and global support staff |
| Capacity (annual PCB area) | ~30 million sq. ft. | Multiple plants across China and international facilities for high-end products |
| Carbon intensity reduction target | 20% reduction by 2028 (baseline 2023) | Targets include energy efficiency, renewable electricity procurement and process optimization |
- Product-level: Rollout of halogen-free, low-VOC laminates and lead-free processing lines to meet stricter environmental standards.
- Process-level: Energy-efficient plating, closed-loop water treatment and waste-heat recovery projects that reduce resource intensity per PCB.
- Customer-level: Collaborative design-for-manufacturing programs to lower material usage and improve lifecycle environmental performance.
Shennan Circuit Company Limited (002916.SZ) - Vision Statement
Shennan Circuit Company Limited (002916.SZ) positions itself as a world-class electronic circuit technology and solution integrator, driven by customer orientation and technology-led development. The company concentrates on high- and mid-end product structures, professional product development, and stable quality performance while embedding green environmental protection across the full product lifecycle - from design and materials selection through manufacturing, assembly, testing, delivery, and end-use.- Persistence: long-term R&D investment and continuous manufacturing process optimization to sustain competitiveness.
- Win‑win cooperation: strategic partnerships with OEMs, module integrators, and global electronics customers to expand value chains.
- Innovation: targeted R&D for advanced PCB, HDI, and micro-assembly solutions to address high-frequency, high‑reliability applications.
- Proactiveness: rapid response engineering, custom design-for-manufacture (DFM) services, and scalable production capacity planning.
- Foresight: forward-looking capacity expansion and product roadmap planning focused on automotive electronics, 5G, industrial control, and medical segments.
- Design and DFM consultation
- PCB manufacturing (single-sided through multilayer, HDI)
- Electronic assembly and micro-assembly services
- Testing, inspection, and reliability verification
- After‑sales technical support and lifecycle services
| Metric | FY2021 | FY2022 | FY2023 | Notes |
|---|---|---|---|---|
| Revenue (RMB) | 7.3 billion | 9.1 billion | 10.2 billion | Consolidated revenue across PCB, assembly, and services |
| Net Profit (RMB) | 0.68 billion | 0.93 billion | 1.08 billion | Post-tax attributable to shareholders |
| R&D Expense (RMB) | 230 million | 320 million | 420 million | Investment in HDI, micro-assembly, and reliability testing |
| Gross Margin | 21.4% | 22.8% | 23.5% | Improvement driven by higher mix of mid-/high‑end products |
| Employees | 6,800 | 7,600 | 8,700 | Manufacturing, R&D, and global sales staff |
| Export Ratio | 58% | 60% | 62% | Direct and indirect exports to Asia, Europe, and North America |
- High-reliability PCBs for automotive ADAS, EV power modules, and industrial control systems.
- HDI and micro-via technologies for consumer electronics and 5G terminal equipment.
- Integrated electronic assembly and micro-assembly for compact modules and sensors.
- Test and reliability labs for thermal cycling, solder fatigue, and high-frequency performance validation.
- Design-for-environment (DfE): material selection and design practices to reduce hazardous substances and facilitate recycling.
- Manufacturing: energy-efficient processes, wastewater treatment, and responsible chemical management in production facilities.
- Product use and end-of-life: guidance for customers on repairability, reuse, and proper recycling channels.
- Move up the value chain via R&D and qualification for automotive and medical certifications.
- Scale one-stop capabilities to capture larger system-level projects from OEMs and EMS providers.
- Leverage foresight in capacity planning to balance global demand shifts and supply-chain localization trends.
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