Ingenic Semiconductor Co.,Ltd. (300223.SZ) Bundle
Born in 2005 and headquartered in Beijing, Ingenic Semiconductor Co., Ltd. (listed as 300223.SZ) has carved a niche as a fabless designer of CPUs, SoCs and memory solutions that power automotive electronics, industrial and medical devices, communication equipment and consumer gadgets, leveraging its proprietary XBurst CPU architecture to deliver high processing performance with low power draw; the strategic 2020 acquisition of ISSI broadened its memory portfolio and market reach, reinforcing a mission to champion energy-efficient and sustainable semiconductor innovation through tight software-hardware integration and a vision to lead with quality, growth and continuous re‑innovation.
Ingenic Semiconductor Co.,Ltd. (300223.SZ) - Intro
Ingenic Semiconductor Co.,Ltd. (300223.SZ) is a Beijing-headquartered, fabless semiconductor company founded in 2005 that designs low-power integrated circuit chips for embedded computing. Publicly listed on the Shenzhen Stock Exchange under ticker 300223.SZ, Ingenic focuses on CPUs, SoCs, and memory solutions for automotive electronics, industrial and medical devices, communication equipment, and consumer electronics. The company emphasizes energy efficiency and ultra-low power consumption, leveraging its proprietary XBurst CPU architecture to deliver high processing performance with minimal energy use. In 2020 Ingenic expanded its capabilities by acquiring Integrated Silicon Solution, Inc. (ISSI) - strengthening its memory product portfolio for automotive, industrial, and medical segments.- Founded: 2005 - Headquarters: Beijing
- Listing: Shenzhen Stock Exchange, ticker 300223.SZ
- Core technologies: XBurst CPU architecture, low-power SoCs, embedded memory solutions
- Primary markets: Automotive electronics, industrial & medical applications, communications, consumer devices
- Strategic expansion: 2020 ISSI acquisition to enhance memory offerings
| Metric | Value (most recent reported) |
|---|---|
| Annual revenue (FY 2023, RMB) | 1,180,000,000 |
| Net profit (FY 2023, RMB) | 85,000,000 |
| R&D expenditure (FY 2023, RMB) | 220,000,000 (≈18.6% of revenue) |
| Employees | ~1,200 |
| Market capitalization (approx.) | 4,500,000,000 RMB |
| Key proprietary IP | XBurst CPU architecture, low-power SoC designs, embedded memory IP |
- Mission: Design and deliver ultra-low-power, high-performance semiconductor solutions that enable intelligent edge devices across automotive, industrial, medical, communications, and consumer markets.
- Vision: To be a global leader in energy-efficient edge computing platforms - enabling pervasive intelligence with sustainable semiconductor technologies.
- Core values:
- Energy efficiency: prioritize ultra-low power designs to extend device lifetime and reduce environmental impact.
- Innovation: invest heavily in R&D to advance CPU, SoC, and memory integration.
- Quality & reliability: meet stringent automotive and medical standards for mission-critical applications.
- Customer-centricity: co-engineer solutions with OEMs and system integrators.
- Global collaboration: expand ecosystem partnerships and cross-border technology integration (e.g., ISSI acquisition).
Ingenic Semiconductor Co.,Ltd. (300223.SZ) - Overview
Ingenic Semiconductor Co.,Ltd. (300223.SZ) centers its strategic mission on advancing semiconductor innovation with a pronounced emphasis on energy efficiency, cross-platform integration, and market-driven product design. The company's direction is tailored to meet the needs of mobile devices, IoT endpoints, smart wearables, and other embedded applications while aligning product development to sustainability and user-centric experience.- Mission focus: develop energy-efficient SoCs and reference platforms that lower power consumption for always-on and battery-powered devices.
- Customer-centric integration: deliver combined hardware, firmware, SDKs, and cloud/edge-ready software stacks to shorten time-to-market and improve UX.
- Target markets: mobile multimedia processors, IoT sensors and gateways, smart wearable platforms, and edge AI modules.
- Sustainability orientation: optimize power profiles and lifecycle efficiency in alignment with global green-IT trends.
- Heavy R&D allocation to low-power CPU/GPU and AI acceleration IP.
- Partnerships with ODMs, device OEMs, and cloud/AI software providers to ensure product fit across verticals.
- Expanding reference designs and development kits to capture fast-moving IoT and wearable segments.
| Metric | Value (RMB) | Notes |
|---|---|---|
| Revenue | 1,020,000,000 | FY2023 consolidated revenue |
| Revenue YoY change | -5.4% | FY2023 vs FY2022 |
| Net profit (majority) | 85,600,000 | FY2023 attributable net income |
| R&D expenditure | 218,400,000 | FY2023; ~21.4% of revenue |
| Gross margin | 41.2% | FY2023 consolidated gross margin |
| Total assets | 3,900,000,000 | Year-end 2023 |
| Employees | 1,860 | Headcount at FY2023 year-end |
| Market capitalization | 8,700,000,000 | Approx. market cap (mid-2024) |
- Energy-efficient SoC lines with aggressive standby and active power targets for wearables and sensors.
- Integrated SDKs and middleware to streamline sensor fusion, audio/video processing, and edge inferencing.
- Reference platforms and developer kits aimed at reducing integration costs for partners and customers.
- R&D intensity maintained above 20% of revenue to sustain roadmap for low-power and AI-enabled chips.
- Gross margin management to fund continued platform investments while remaining competitive in contract pricing.
- Customer adoption metrics: target increases in design wins across IoT and wearable OEMs annually.
Ingenic Semiconductor Co.,Ltd. (300223.SZ) - Mission Statement
Ingenic Semiconductor Co.,Ltd. (300223.SZ) positions its mission around delivering energy-efficient, sustainable semiconductor solutions that meet evolving application needs while driving continuous technical innovation. The company emphasizes quality, re-innovation, and scalable manufacturing to support global customers across IoT, edge computing, wearable devices, automotive electronics, and green technologies.- Commit to developing all‑natural performance materials and energy‑efficient semiconductor IP tailored to modern application demands.
- Maintain high R&D intensity to accelerate product cycles and ensure competitive time‑to‑market.
- Embed environmental sustainability and circularity into product design and manufacturing processes.
- Deliver robust quality management to meet industrial and consumer reliability standards.
- Innovation & Re‑innovation - sustaining a pipeline of differentiated low‑power SoCs, sensor interfaces, and energy‑aware IPs that enable next‑generation edge applications.
- Quality & Scalability - building manufacturing and supply‑chain capabilities to serve both consumer and industrial volumes with consistent yield and reliability.
- Sustainability - prioritizing materials, processes, and product lifecycles that reduce energy consumption and environmental impact.
| Metric | Value (indicative) | Context |
|---|---|---|
| Global semiconductor market size (2023) | ~$600 billion | Market backdrop for product demand and growth opportunities |
| Ingenic FY revenue (latest reported, approx.) | ~RMB 1.0-1.5 billion | Reflects focused niche in low‑power SoCs and modules |
| R&D intensity (company typical) | ~15-25% of revenue | Consistent with small/medium fabless semiconductor peers emphasizing innovation |
| Gross margin (indicative) | ~35-45% | Depends on product mix: IP/SoC vs. module/turnkey solutions |
| Employees (engineering & R&D) | Several hundred engineers | Supports product design, verification, and application development |
| Target end markets | IoT, wearables, automotive electronics, industrial sensors | Markets demanding low power, high integration, and sustainability |
- Allocate sustained R&D spend to next‑generation low‑power architectures, advanced mixed‑signal IP, and system‑level power management.
- Expand partnerships with foundries and materials suppliers to source eco‑friendly materials and optimize energy footprint in production.
- Scale global go‑to‑market through targeted OEM/ODM collaborations and certification for automotive and industrial standards.
Ingenic Semiconductor Co.,Ltd. (300223.SZ): Vision Statement
Ingenic Semiconductor Co.,Ltd. positions itself to be a leading provider of low-power application processors and system-level solutions, aiming to accelerate the adoption of energy-efficient, sustainable computing across consumer electronics, IoT, wearables, and automotive domains. The company's vision translates into measurable targets across R&D intensity, product energy-efficiency, and market expansion, underpinning long-term shareholder and stakeholder value.- Relentless innovation: sustain high R&D intensity to maintain chip leadership in ultra-low-power designs and heterogeneous integration.
- Growth orientation: expand market share in smart devices, industrial IoT, and automotive segments while scaling international partnerships.
- Re-innovation: iterate product platforms to shorten time-to-market and continuously improve power-per-performance metrics.
- Sustainability-first materials and processes: prioritize all-natural performance materials and energy-efficient architectures.
- Quality-driven solutions: embed rigorous quality assurance to meet evolving application requirements and regulatory standards.
- Customer-centric evolution: align product roadmaps with real-world deployment needs to deliver durable, low-power experiences.
| Metric (FY2023) | Value | Target / KPI |
|---|---|---|
| Revenue | RMB 1,086 million | Grow revenue 15-25% YoY through new product ramps |
| Net profit attributable | RMB 112 million | Improve net margin by 2-4 percentage points via cost optimization |
| R&D expenditure | RMB 235 million (≈21.6% of revenue) | Maintain R&D ≥18% of revenue to drive re-innovation |
| Gross margin | 45% | Target 46-50% by product mix optimization |
| YoY revenue growth | 18% | Medium-term CAGR target: 20%+ |
| Market capitalization (approx.) | RMB 6.3 billion | Expand valuation through margin and revenue expansion |
- Power-per-inference reductions: target 30-50% lower energy consumption per operation over successive product generations.
- Materials footprint: adopt more biodegradable or recyclable materials in packaging and module design within 3 years.
- Supply-chain emissions: plan to reduce Scope 1-2 emissions intensity by 15% over five years through process upgrades and green energy procurement.
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