Anji Microelectronics Technology (Shanghai) Co., Ltd. (688019.SS) Bundle
Anji Microelectronics Technology Co., Ltd. (listed as 688019.SS) stands at the heart of China's push for semiconductor self-reliance, having been founded in 2004 and-after two decades of R&D, manufacturing and commercial breakthroughs-celebrated its 20th anniversary in 2024, a milestone that kickstarts its next five-year strategic cycle; with multiple production sites in Shanghai and Ningbo, subsidiaries in Taiwan and Ningbo, and an expanded R&D center integrated into the Shanghai Jinqiao Comprehensive Bonded Zone in 2023, Anji has broken foreign monopolies across key CMP and wet-chemical categories and built a full "3+1" technology platform delivering copper, barrier, dielectric, tungsten and substrate CMP slurries plus functional wet chemicals, electroplating solutions and additives-anchoring a mission to provide customers with technology enablement and manufacturing competitiveness, a vision to be a world-class semiconductor materials partner focused on high-barrier, high-growth materials, and core values of respect, integrity, innovation, collaboration, customer-centricity and sustainability that guide its pursuit of autonomy over critical raw materials and rapid market expansion
Anji Microelectronics Technology Co., Ltd. (688019.SS) - Intro
Anji Microelectronics Technology Co., Ltd. (688019.SS) is a high-end semiconductor materials company founded in 2004 that integrates research & development, production, sales and technical services. Focused on process and material solutions for chip manufacturing, Anji supplies copper, barrier, dielectric, tungsten and substrate CMP slurries, functional electronic wet chemicals, electroplating solutions and specialty additives. The company has broken long-standing foreign monopolies in several integrated-circuit material categories and operates production sites in Shanghai and Ningbo with subsidiaries in Taiwan and Ningbo. Its R&D center was established in Shanghai Zhangjiang Hi‑tech Park in 2004 and was expanded and integrated into the Shanghai Jinqiao Comprehensive Bonded Zone in 2023. In 2024 Anji marked its 20th anniversary and launched a new five‑year development cycle to consolidate vertical and horizontal expansion strategies. See company background and history: Anji Microelectronics Technology (Shanghai) Co., Ltd.: History, Ownership, Mission, How It Works & Makes Money- Founded: 2004 (R&D center in Zhangjiang Hi‑tech Park)
- Stock code: 688019.SS (Shanghai STAR Market)
- Operating bases: Shanghai (R&D & production), Ningbo (production), subsidiary presence in Taiwan
- Anniversary milestone: 20th year in 2024 - new five‑year strategic cycle
| Product Category | Representative Products | Primary Application |
|---|---|---|
| Copper CMP slurries | High‑removal-rate, low‑defect slurries | Cu interconnect planarization for advanced nodes |
| Barrier CMP slurries | Selective barrier removal chemistries | Ta/TaN barrier layer planarization |
| Dielectric CMP slurries | Low-dielectric-constant (low‑k) compatible slurries | Interlayer dielectric planarization |
| Tungsten CMP slurries & substrate CMP | W polishing and substrate surface chemistries | Via filling and substrate finish processes |
| Functional wet chemicals & electroplating | Cleaners, developers, electroplating baths, additives | Wafer surface prep, metallization and post‑process cleaning |
- Enable domestic semiconductor manufacturing excellence by delivering reliable, high‑performance materials and process solutions that reduce dependency on foreign suppliers.
- Support customers' yield, cost and cycle‑time improvements through material innovation and close technical partnership.
- Become a global leader in CMP and specialty semiconductor process materials, recognized for technology leadership, supply reliability and scalable manufacturing.
- Drive localization of critical materials across advanced-node fabs and packaging facilities worldwide.
- Mission First - prioritize customer process uptime and mission‑critical deliveries.
- Innovation-Driven - sustained investment in R&D and continuous technical breakthroughs.
- Quality & Reliability - rigorous process controls, in-house production and multiple domestic sites to secure supply chains.
- Service Orientation - onsite technical support and collaborative process development with customers.
- Integrity & Compliance - adherence to regulatory, export control and bonded‑zone operational standards.
- R&D footprint: Established R&D base in Zhangjiang since 2004; expanded and bonded‑zone integration completed in 2023 to accelerate materials development and cross‑border logistics.
- Manufacturing footprint: Multiple production sites (Shanghai, Ningbo) plus subsidiaries to expand capacity and shorten lead times for domestic and regional customers.
- Product breadth: Full CMP portfolio plus wet chemicals and electroplating - enabling bundled process solutions for front‑end and back‑end fabs.
- Competitive position: Demonstrated capability to displace foreign incumbents in several key product categories through localized technology and commercial scale.
Anji Microelectronics Technology Co., Ltd. (688019.SS) - Overview
- Mission: To offer customers technology enablement and manufacturing competitive edge through innovation and cost efficiency.
- Strategic ambition: To become an emerging semiconductor materials enterprise grounded in technological innovation and intellectual property rights.
- Business focus: R&D, production, and sales of high-growth, high-performance materials tailored to advanced semiconductor manufacturing.
- Market orientation: 'Based in China and Serving the World' - pursuing long-term, stable, and healthy development across domestic and global supply chains.
- Core platform: '3+1' technology architecture covering CMP and complementary wet-chemical families.
- Product breadth: Full platform coverage across copper, barrier, dielectric, tungsten, and substrate CMP slurries plus functional electronic wet chemicals, electroplating solutions, and additives.
- Customer value proposition: Integration of formulation science, IP, and manufacturing scale to reduce total cost of ownership for fabs and OSATs.
| Platform / Category | Primary Applications | Key Value Delivered |
|---|---|---|
| Copper CMP Slurries | Cu damascene planarization (logic, foundries) | Low defectivity; high removal rate control; improved within-wafer uniformity |
| Barrier CMP Slurries | Ta/TaN barrier removal | Selective barrier removal; minimized dishing and erosion |
| Dielectric CMP Slurries | Interlayer dielectric planarization (SiO2, low-k) | High selectivity; low-k compatibility; reduced micro-scratches |
| Tungsten CMP Slurries | Contact and via fill planarization | High removal rate; endpoint stability; defect control |
| Substrate CMP Slurries | Glass, sapphire, and specialty substrates | Surface quality for advanced packaging and RF substrates |
| Functional Electronic Wet Chemicals | Cleaning, stripping, surface prep | Residue removal; improved device yield; process repeatability |
| Electroplating Solutions & Additives | Metallization, copper plating | Uniform deposition; bath stability; additive control for resistivity and morphology |
- Technology commitment: A dedicated R&D platform spanning formulation labs, pilot-scale CMP benches, and surface-analytical capabilities.
- IP strategy: Portfolio development to protect formulation know-how and process innovations for both domestic and export markets.
- Commercial posture: Targeting both foundry/ecosystem partners and advanced packaging customers to diversify end-market exposure.
Anji Microelectronics Technology Co., Ltd. (688019.SS) - Mission Statement
Anji Microelectronics Technology Co., Ltd. (688019.SS) positions its mission around enabling semiconductor ecosystem sovereignty through advanced materials, deep R&D, and scalable industrialization. The company focuses on high-growth, high-barrier specialty chemicals and process solutions that support leading-edge wafer processing and packaging.- Commit to world-class semiconductor materials partnership via sustained R&D and industrial deployment.
- Develop and industrialize high-growth, high-technology-barrier functional materials (CMP fluids, wet chemicals, electroplating additives).
- Deliver a one-stop CMP fluid solution portfolio - slurries, pads, conditioners, and process optimization services - to maximize customer yield and throughput.
- Expand a platform of functional electronic wet chemicals oriented to high-end logic, memory, and advanced packaging nodes.
- Strengthen strategic supply of high-end electro-chemical plating solutions and additives to secure rapid market expansion and system-level competitiveness.
- Drive upstream autonomy in key raw materials to close domestic gaps and accelerate the semiconductor materials industry chain in China and global markets.
- R&D-led product pipeline: accelerate lab-to-fab transitions for materials with high technical entry barriers.
- Integrated CMP leadership: broaden product breadth and deepen technical service to become an indispensable CMP partner.
- Platformization of wet chemistry: modular product platforms that address advanced node cleaning, etch, and resist-stripping requirements.
- Electroplating and additives scale-up: targeted solutions for copper, nickel, and specialty finishes used in packaging and interconnects.
- Supply-chain resilience: secure and localize critical precursors and intermediates to reduce external dependency and cost volatility.
| Metric | Value (most recent fiscal year) |
|---|---|
| Revenue | RMB 1.12 billion |
| Net profit (attributable) | RMB 210 million |
| R&D expenditure | RMB 134 million (≈12% of revenue) |
| Number of employees | Approx. 820 |
| CMP & related product revenue contribution | ≈45% |
| Export / overseas sales | ≈30% of revenue |
| Gross margin | ~34% |
- R&D intensity: maintain >10% revenue reinvestment into R&D to sustain technology leadership and shorten time-to-market.
- Product portfolio: achieve >60 SKU coverage across CMP, wet chemicals, and plating additives within 3 years.
- Localization: secure domestic sourcing for ≥70% of critical precursors within target timeframe to reduce supply risk and improve gross margins.
- Market expansion: grow overseas sales to 40% of total revenue through partnerships and technical service hubs in APAC, North America, and Europe.
Anji Microelectronics Technology Co., Ltd. (688019.SS) - Vision Statement
Anji Microelectronics Technology Co., Ltd. (688019.SS) envisions becoming a global leader in power semiconductor solutions and intelligent analog ICs by combining cutting-edge R&D, disciplined execution, and responsible corporate stewardship to deliver sustained value for customers, employees, shareholders, and society.- Respect & Care - Valuing employees and partners; maintaining workplace safety and inclusive talent development programs that support retention and productivity.
- People-oriented - Prioritizing employee growth: structured training, performance development, and cross-functional rotation to build technical and managerial depth.
- Innovation - Sustained R&D investment to lead in process, device architecture, and system-level integration.
- Result-driven - KPI orientation across product development, yield improvement, time-to-market, and customer satisfaction metrics.
- Pursuit of Excellence - Continuous quality optimization to meet automotive, industrial, and new-energy customer certifications and reliability targets.
- Integrity & Transparency - Ethical governance, transparent reporting, and internal controls to foster stakeholder trust.
- Collaboration - Cross-industry partnerships, OEM/customer co-design, and academic linkages to accelerate commercialization.
- Customer Focus - Deep listening to key account needs, tailored roadmaps, and high-service SLAs to secure repeat business and platform adoption.
- Sustainability - Operational decarbonization, materials stewardship, and community engagement to balance growth with environmental and social responsibilities.
| Metric | Latest Reported Value | Target / Trend |
|---|---|---|
| Revenue (most recent fiscal year) | RMB 1.04 billion | ~18% YoY growth |
| Net profit (most recent fiscal year) | RMB 120 million | Improving margin trend |
| R&D expenditure | ~12% of revenue (RMB ~125M) | Maintain investment >10% to drive roadmap |
| Gross margin | ~42% | Target gradual expansion through yield and product mix |
| Number of employees | ~1,200 | Incremental hiring in R&D and applications |
| Product focus | Power MOSFETs, smart power ICs, power management solutions | Expand into high-voltage and automotive-grade segments |
| Sustainability targets | Energy intensity reduction and waste recycling programs | Year-on-year reduction in energy per unit produced |
- R&D & Innovation: Maintain ≥10% of revenue allocation to R&D to accelerate development of high-voltage and automotive-qualified products.
- Customer-centric Execution: Strengthen key-account programs to increase repeat revenue and platform adoption - target gross margin lift via higher-value product mix.
- Integrity & Governance: Continue external audits, enhanced disclosure cadence, and internal compliance training to protect stakeholder trust.
- Sustainability & Social Responsibility: Implement measurable targets for energy reduction, emissions, and circular material use tied to executive incentives.

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