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Amkor Technology, Inc. (AMKR): PESTLE Analysis [Nov-2025 Updated] |
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Amkor Technology, Inc. (AMKR) Bundle
You're trying to navigate Amkor Technology, Inc.'s path, and honestly, it boils down to a high-stakes race: the massive technological tailwind of AI versus the brutal headwind of global politics. The demand for advanced packaging-like 2.5D/3D integration-is defintely surging, creating a huge opportunity, but this growth demands colossal capital expenditure (CapEx) while US-China trade tensions complicate every supply chain decision. We'll show you exactly how geopolitical risk, the high CapEx required for new technology, and the critical shortage of skilled engineers are mapping out AMKR's near-term strategy, so you can make a smarter investment or business decision right now.
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Political factors
US-China trade tensions complicate supply chain logistics and market access.
The ongoing trade and technology conflict between the US and China is a primary political risk for Amkor Technology, Inc. As a major provider of outsourced semiconductor assembly and test (OSAT) services, Amkor operates a complex global supply chain that is directly exposed to these geopolitical friction points. The US government's restrictions on the export of advanced semiconductor technology to China force companies like Amkor to constantly re-evaluate their operational footprint and client strategy.
This uncertainty makes long-term capital planning defintely more difficult. It's not just about tariffs; it's about the risk of sudden policy shifts that could disrupt the flow of equipment, materials, or finished goods. To be fair, Amkor must navigate a dual mandate: serving its global customer base while complying with increasingly stringent US export controls. This means a constant, costly effort to ensure compliance across all its facilities.
- Comply with US export control rules.
- Re-route supply chains to mitigate risk.
- Manage market access uncertainty in China.
CHIPS and Science Act funding creates incentives for US-based manufacturing expansion.
The US CHIPS and Science Act represents a significant political opportunity, aiming to revitalize domestic semiconductor manufacturing. For Amkor, this legislation offers potential financial incentives-grants, loans, and tax credits-to expand its advanced packaging capabilities within the United States. This is a clear action signal from the US government to de-risk the supply chain by building out a robust onshore ecosystem.
While the company has historically focused its major assembly and test operations in Asia, the CHIPS Act funding is a powerful catalyst for a strategic pivot. Moving some packaging capacity to the US would reduce geopolitical risk and position Amkor to serve key domestic clients, particularly those in defense and high-performance computing, more securely. This is a long-term play, but the political will and the capital are now aligned to make it happen.
Geopolitical risk tied to manufacturing concentration in South Korea and Taiwan.
Amkor's operational backbone is heavily concentrated in Asia, particularly in South Korea and Taiwan, which are high-risk geopolitical hotspots. South Korea, where Amkor maintains significant operations, borders North Korea, and the ongoing tensions are a persistent, low-level threat to stability. Taiwan, a global hub for semiconductor manufacturing, faces constant military and political pressure from mainland China.
This concentration means that any escalation in these regions-a sudden military incident, a major trade blockade, or a severe political disruption-could immediately and severely impact Amkor's production capacity and global revenue. This isn't theoretical; it's a critical, uninsurable risk. So, the political stability of these two nations is directly linked to Amkor's financial performance. This is why diversification is key.
Here's a quick look at the operational exposure in key Asian regions:
| Region | Political Risk Factor | Impact on Operations |
| South Korea | North Korea border tensions, regional security volatility | Risk of supply chain disruption, mandatory government-led security measures |
| Taiwan | Cross-Strait tensions with mainland China, military exercises | Potential for trade route disruption, operational halts due to political instability |
| China | US export controls, domestic regulatory changes | Market access restrictions, technology transfer limitations |
Tariffs and export controls on advanced semiconductor equipment affect capital expenditure.
The political environment directly influences Amkor's capital expenditure (CapEx) strategy by controlling the flow and cost of advanced manufacturing equipment. Export controls imposed by the US and its allies (like the Netherlands and Japan) on equipment used to manufacture cutting-edge semiconductors-especially those related to advanced packaging-create two major problems.
First, it increases the cost and complexity of acquiring this equipment for facilities outside of the US-aligned nations. Second, it limits where Amkor can deploy its most advanced technology, particularly in China. This forces Amkor to allocate its CapEx strategically to regions that are politically stable and compliant with all regulatory regimes. For instance, if Amkor were to plan a major CapEx investment, the political risk assessment of the location is now as important as the market demand. This political pressure fundamentally shapes the company's investment decisions.
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Economic factors
Global semiconductor market cyclicality impacts utilization rates and pricing power.
The semiconductor industry is defintely cyclical, but 2025 is shaping up to be a strong growth year overall. Global semiconductor sales are projected to reach approximately $697 billion, a significant increase from 2024, driven heavily by demand for Generative AI (Gen AI) chips. This high-growth segment is where Amkor Technology focuses its Advanced packaging efforts.
The immediate impact is visible in Amkor's factory utilization and pricing power. In Q3 2025, net sales hit $1.99 billion, a massive 31% sequential increase, which was directly attributed to robust demand in Communications and Computing end markets. This volume leverage helped push the gross margin up to 14.3% in Q3 2025, a solid recovery from the 12.0% seen in Q2 2025, showing that high utilization is the key to expanding profitability.
Still, the market remains uneven. Amkor's Q4 2025 revenue guidance midpoint of $1.83 billion reflects a seasonal sequential decline, even with year-over-year growth. The company is navigating a split market: high-volume, high-margin Advanced packaging is booming, but mainstream segments can still face pricing pressure.
High capital expenditure (CapEx) required for advanced packaging technology investments.
Competing in the advanced packaging space, especially for high-performance computing and AI, requires a massive and continuous capital expenditure (CapEx) commitment. It's not a cheap game to play. Amkor Technology is investing aggressively to maintain its technology leadership and expand its geographic footprint.
The company increased its full-year 2025 CapEx forecast to approximately $950 million. This significant investment is earmarked for capacity expansion and technological capabilities, most notably the new Advanced packaging and test campus in Arizona. The total projected investment for the Arizona campus alone has been increased to $7 billion over the long term, a clear signal that CapEx is a strategic lever, not just a line item.
Here's the quick math on recent CapEx and debt:
- 2025 Full-Year CapEx Forecast: ~$950 million
- Total Debt (as of Sep 30, 2025): $1.8 billion
- Total Liquidity (as of Sep 30, 2025): $3.2 billion
Inflationary pressures on raw materials (e.g., gold, copper) and energy costs.
Inflation is a persistent headwind, especially for a business with high material content like semiconductor packaging. You see this directly in the gross margin pressure, which is constrained by both the higher material content of advanced products and general manufacturing cost inflation.
The cost of key metals used in packaging is rising:
- Gold: Predicted to reach $2,600 per ounce by the end of 2025.
- Copper: Forecasted to hit $4.30 to $4.80 per pound by the end of 2025, fueled by demand from electric vehicles and 5G/IoT.
This reality forces the company to either pass costs to customers or absorb them, which is why Q3 2025 gross margin of 14.3% was still slightly below the 14.6% reported a year prior, despite much higher volume.
Currency fluctuations, particularly the South Korean Won, affect reported earnings.
With significant manufacturing operations in South Korea, currency volatility, particularly with the South Korean Won (KRW), is a constant factor in Amkor's financial reporting. It's a double-edged sword: a weaker KRW generally makes their Korean-based costs cheaper when translated back to US Dollars, boosting margins, and vice-versa.
In Q2 2025, for example, Amkor faced foreign currency headwinds of approximately 80 basis points (0.8%) on its gross margin, showing a clear negative impact from currency movement. Conversely, Q3 2025 saw a favorable foreign currency impact, which was cited as a contributor to net income more than doubling to $127 million. You have to watch that KRW/USD exchange rate closely.
Interest rate environment influences the cost of financing CapEx projects.
The interest rate environment set by the US Federal Reserve directly impacts the cost of Amkor's substantial debt load, which stood at $1.8 billion at the end of Q3 2025. The good news is that the Fed has shifted to an easing cycle in 2025.
The Federal Funds Rate target range was lowered twice in the latter half of 2025, reaching 3.75%-4.0% by late October. This easing trend is favorable, as it lowers the cost of floating-rate debt and makes refinancing fixed-rate debt cheaper over time. For context, the company's interest expense was manageable at $16.8 million in Q2 2025, but any further rate cuts will reduce the drag from their $1.2 billion in long-term debt. They even redeemed $400 million of senior notes in October 2025, a move that reduces future interest payments and strengthens the balance sheet.
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Social factors
Growing consumer demand for AI-enabled devices drives need for high-density packaging.
You are seeing a fundamental shift in the semiconductor market, and it's being driven by what people are buying: AI-enabled devices. This isn't just about massive data centers anymore; it's about AI PCs and edge AI, which put high-performance computing right into the consumer's hand. This demand is a direct tailwind for Amkor Technology, Inc. because AI chips need advanced packaging (AP) to function efficiently.
The global semiconductor market is projected to reach an enormous $800 billion in 2025, and a significant portion of that growth is tied to the complexity of the packaging. The global advanced packaging market itself is projected to be valued at approximately $40.34 billion in 2025, with a robust Compound Annual Growth Rate (CAGR) of 7.59% expected through 2034. Amkor is already capitalizing on this; the company's Q3 2025 results showed that Advanced Packaging set a new revenue record, fueled by this exact demand in the communications and computing sectors. This is a clear-cut opportunity, but it means Amkor must keep its capital expenditure high-projected at roughly $950 million for the full year 2025-to keep up with capacity.
Shortage of highly skilled engineering talent for advanced packaging R&D and operations.
Honestly, the biggest near-term risk for the entire semiconductor industry isn't a lack of capital; it's a lack of talent. The move to advanced packaging, which involves highly complex processes like 2.5D and 3D integration, requires a new class of engineer. The industry at large is facing serious workforce challenges in 2025, especially in mission-critical skills like machine learning, robotics, and data analytics, which are now embedded into manufacturing.
Amkor is tackling this head-on with its massive domestic expansion. The new Arizona advanced packaging campus, a planned $7 billion investment, will create up to 3,000 high-quality jobs. The challenge is developing a pipeline of workers capable of filling those roles. To be fair, Amkor is actively partnering with local educational institutions, like Arizona State University, but training a workforce for advanced packaging takes years. If onboarding takes 14+ days, churn risk rises. This talent gap is a major operational constraint that could limit the speed of their U.S. production ramp-up, which is crucial for customers like Apple and NVIDIA.
Increased focus on ethical sourcing and labor practices in the global supply chain.
The social license to operate is tightening, particularly for companies with complex global supply chains like Amkor. The electronics industry is flagged as an 'especially high-risk' sector for forced labor concerns, which means investors and customers are applying heightened scrutiny to ethical sourcing and labor practices.
Amkor has been proactive here, which is smart risk mitigation. They have been a member of the Responsible Business Alliance (RBA) and the Responsible Minerals Initiative (RMI) since 2010. Crucially, the company achieved the Full RBA membership status, which is the highest category, demonstrating a commitment to ethical standards that goes beyond mere compliance. This commitment is vital because a single labor or sourcing scandal can wipe out months of positive brand equity. The focus for 2025 is less on having a policy and more on verifiable, transparent auditing deep into the lower tiers of the supply chain.
- Maintain Full RBA membership status for labor standards.
- Adhere to Responsible Minerals Initiative (RMI) guidelines.
- Partner with customers like Infineon to strengthen supplier engagement.
Demand for greater corporate transparency in environmental, social, and governance (ESG) reporting.
For a seasoned investor like you, ESG is no longer a niche consideration; it's a core valuation factor. Regulators and institutional investors are demanding higher standards and greater transparency in reporting. Amkor is responding by enhancing its disclosure, which is a clear positive signal to the market.
The company has achieved Prime Status from ISS (Institutional Shareholder Services), which means its sustainability performance is above the sector-specific threshold-a strong indicator of leadership. On the environmental side, the company verified its net-zero greenhouse gas (GHG) emissions target by 2050 with the Science Based Targets initiative (SBTi). They also plan to further increase renewable energy procurement in 2025. This level of transparency helps mitigate regulatory risk and appeals to the growing pool of capital focused on sustainable investing.
Here's a quick look at how Amkor's 2025 financial performance underpins its ability to fund these social and environmental commitments:
| 2025 Financial/Social Metric | Q3 2025 Value | Significance to Social Factors |
|---|---|---|
| Net Sales | $1.99 billion | Revenue strength funds $950 million in 2025 CapEx for advanced packaging, which drives high-quality jobs. |
| Net Income | $127 million | Profitability supports long-term, non-revenue generating ESG initiatives and talent development programs. |
| Full Year 2025 CapEx (Projected) | $950 million | The investment in capacity, including the Arizona campus, directly addresses the need for domestic, high-tech employment (up to 3,000 jobs). |
| ISS ESG Rating | Prime Status | Confirms leadership in sustainability performance relative to peers, satisfying investor demand for transparency. |
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Technological factors
Rapid shift to advanced packaging (e.g., 2.5D/3D integration, fan-out) requires massive R&D.
The semiconductor industry's pivot to advanced packaging is the core technological driver for Amkor Technology. You see this clearly in the company's capital allocation, which is aggressively funding next-generation solutions like 2.5D/3D integration and High Density Fan Out (HDFO). This isn't cheap, but it's where the high-margin work is. Amkor has increased its full-year 2025 Capital Expenditure (CapEx) forecast to approximately $950 million to support this expansion, up from earlier estimates. A huge piece of this is the new advanced packaging and test campus in Arizona, a multi-year project with a total planned investment of $7 billion across two phases. This investment directly enables the high-volume manufacturing of complex packages for Artificial Intelligence (AI) and High-Performance Computing (HPC) applications, which fueled Amkor's record advanced packaging revenue in the third quarter of 2025.
Here's the quick math on the R&D commitment:
| Metric | Value (12 Months Ending Sep 30, 2025) | Note |
|---|---|---|
| R&D Expenses | $0.173 billion | A 6.9% increase year-over-year. |
| Full-Year 2025 CapEx (Advanced Tech Focus) | ~$950 million | Focused on leading-edge capacity. |
| Q3 2025 Advanced Packaging Revenue | Record-setting | Fueled by demand in Communications and Computing. |
Need for continuous process innovation to meet smaller node requirements from foundry partners.
As foundry partners like TSMC push to smaller process nodes-think 3nm and beyond-the packaging must keep pace. The physical distance between the chip and the package becomes a critical performance factor, so Amkor must continually innovate its process technology to maintain electrical and thermal integrity. This is a non-stop technical race. The new Arizona facility is defintely a strategic move to enable a full end-to-end semiconductor supply chain within the U.S., working closely with domestic foundry manufacturing to co-develop solutions for these smaller nodes. The company's focus on High Density Fan-Out (HDFO) technology, which is ramping into production for new products in Q4 2025, is a direct response to the need for ultra-fine line wiring and high-density interconnects required by next-generation silicon.
Automation and smart factory initiatives to improve manufacturing yield and efficiency.
High-volume, high-mix manufacturing like Amkor's demands high yields and operational efficiency to protect gross margins. The massive CapEx of $950 million for 2025 isn't just for new buildings; a significant portion is dedicated to advanced equipment and automation to enhance operational efficiency. For example, the company's advanced packaging and test lines in Korea and Taiwan are running at high utilization rates, and the CapEx is expanding capacity in these locations to leverage that efficiency. When you're dealing with complex 3D stacking and chiplet integration, automation is the only way to ensure the precision needed for high yields. If you can't automate, your costs will kill you.
Cybersecurity risks for intellectual property (IP) and operational technology (OT) systems are rising.
As a key player in the semiconductor supply chain, Amkor holds the intellectual property (IP) for some of the world's largest chip companies, including Apple and NVIDIA. This makes the company a prime target for cyber threats. The risk isn't just about data breaches; it's about operational technology (OT) systems-the machinery and software that run the factory floor-being compromised, which could halt production and destroy valuable wafers. Amkor's 2025 SEC filings explicitly acknowledge the exposure to risks from cybersecurity breaches that could result in unauthorized disclosure of confidential information and operational disruptions. Protecting this proprietary technology is a constant, high-stakes battle, and their ability to do so is a critical, non-financial technological factor.
The company is defintely a leader in heterogeneous integration.
Amkor is strategically positioned as a leader in heterogeneous integration (HI)-the practice of combining multiple chips (or chiplets) with different functions into a single, high-performance package. This is the future of high-end computing. The company's strategic focus on chiplet and 3D packaging technologies, particularly for AI and High-Performance Computing (HPC) customers, confirms this leadership. Their High Density Fan-Out (HDFO) technology and advanced System-in-Package (SiP) solutions are key enablers for this trend, allowing them to capture the high-value, technically tricky part of the market.
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Legal factors
You need to be a trend-aware realist when assessing Amkor Technology, Inc.'s legal landscape. This isn't just about avoiding fines; it's about managing the legal costs of a complex, global supply chain that is now squarely in the crosshairs of geopolitical strategy. Your biggest legal risks map directly to your most advanced technology and your global footprint.
Compliance with complex international trade regulations and export control laws
The biggest legal headwind for Amkor Technology, Inc. in 2025 is the geopolitical fragmentation of the semiconductor supply chain. The company operates globally, with manufacturing sites in Asia, Europe, and a new advanced packaging and test campus breaking ground in Arizona. This global footprint, while a competitive advantage, exposes it to a patchwork of trade restrictions.
Specifically, the U.S. Bureau of Industry and Security (BIS) Regulations, which restrict the sale of U.S. semiconductor technology to certain entities in China, create a significant compliance burden and risk. These export control laws are not static; they are constantly evolving, and a misstep could trigger massive penalties or the loss of key markets. Honestly, navigating the U.S.-China tech rivalry is the single most defintely challenging legal compliance issue for the entire Outsourced Semiconductor Assembly and Test (OSAT) sector right now.
The risk isn't just in direct sales but in the entire supply chain, which includes managing compliance for materials like Tantalum, Tin, Tungsten, and Gold, as required by Conflict Minerals Regulations.
Intellectual property (IP) protection is critical given the company's advanced technology portfolio
Amkor Technology's strategy is explicitly focused on leadership in advanced packaging, including high-density fan-out and System-in-Package (SiP) solutions for high-performance computing (HPC) and Artificial Intelligence (AI) applications. This innovation is protected by a substantial Intellectual Property portfolio.
The company has a total of 3,238 patents globally, with over 1,844 patents currently active, demonstrating a clear commitment to protecting its core technology. However, the 10-Q filings acknowledge that intellectual property transactions and disputes are an ongoing risk, which is a simple reality of being a leader in a competitive, high-tech industry. The constant threat of infringement litigation, particularly from competitors in South Korea, the United States, and Taiwan, necessitates substantial legal and R&D investment to maintain its competitive moat.
Environmental Protection Agency (EPA) and international waste/chemical disposal regulations are tightening
Environmental, Health, and Safety (EHS) compliance is a growing legal and financial factor. The tightening of global regulations, including those from the U.S. EPA and various international bodies, directly impacts manufacturing costs and operations. Amkor Technology is proactively managing this risk with concrete, public targets, which is a clear action item for investors to track.
The company has committed to achieving net-zero greenhouse gas (GHG) emissions by 2050, with a near-term target to reduce absolute Scope 1 and 2 GHG emissions by 55% by 2033 from a 2022 base year. They also target a 20% reduction in waste generation by 2030. Furthermore, the company established a task force in 2024 to manage per- and polyfluoroalkyl substances (PFAS), a class of chemicals facing increasing regulatory scrutiny worldwide.
Here is a snapshot of the legal and compliance focus areas for the 2025 fiscal year:
| Legal & Compliance Metric (FY 2025 Data) | Value/Target | Legal Implication |
|---|---|---|
| Q3 2025 Net Income | $127 million | Financial capacity to absorb unforeseen legal costs/fines. |
| Active Global Patents | Over 1,844 patents | High IP litigation risk/defense cost, but strong competitive moat. |
| GHG Reduction Target (Scope 1 & 2) | 55% reduction by 2033 (from 2022 base) | Mandates significant capital expenditure on compliance and process upgrades. |
| International Trade Risk Mentioned in 10-Q | BIS Regulations (U.S. export controls) | Requires continuous, high-cost compliance and risk management for global sales. |
| RBA Audit Status (e.g., Taiwan T5) | Platinum status (2025) | Demonstrates compliance with environmental and labor standards, mitigating supply chain legal risk. |
Antitrust scrutiny in the global Outsourced Semiconductor Assembly and Test (OSAT) market
While there is no public information pointing to a specific, active antitrust investigation against Amkor Technology, Inc. in 2025, the risk is structural. The global OSAT market is competitive but also highly concentrated, with the top players controlling a significant share. The global OSAT market size is valued at approximately $46.50 billion in 2025, and it is projected to grow at a CAGR of 7.90%. Any significant merger or acquisition in this space, especially given the current push for supply chain resilience and domestic manufacturing in the U.S., would draw immediate attention from the Department of Justice (DOJ) and international regulatory bodies.
The key legal risk here is a regulatory one, stemming from the market's structure:
- Market Consolidation: The OSAT industry is prone to consolidation, and any large-scale M&A activity by Amkor Technology or its key competitors would face intense antitrust review.
- Advanced Packaging Dominance: The company's focus on high-growth areas like advanced packaging for AI and HPC could lead to scrutiny over market power in these critical, next-generation technology segments.
- Geographic Concentration: The global nature of the business means that antitrust approval would be required across multiple jurisdictions (US, EU, China, Korea), complicating and delaying strategic decisions.
You should assume that any major strategic move-like acquiring a smaller, specialized competitor-will have a 12-to-18-month regulatory review timeline, plus significant legal costs. That's just the cost of doing business at this scale.
Amkor Technology, Inc. (AMKR) - PESTLE Analysis: Environmental factors
Pressure to reduce Scope 1 and 2 greenhouse gas (GHG) emissions from manufacturing operations.
You need to know that Amkor Technology is under significant pressure from customers and investors to decarbonize, and they have committed to a net-zero greenhouse gas (GHG) emissions goal by 2050. This commitment is validated by the Science Based Targets initiative (SBTi), which sets a rigorous, absolute-based reduction path. The near-term target is to reduce absolute Scope 1 and 2 GHG emissions by 55% by 2033 from a 2022 base year. To be fair, this is a massive undertaking for a growing manufacturing business.
The company's Scope 2 emissions, which come primarily from purchased electricity, are much more substantial than their Scope 1 direct emissions. So, the core strategy for 2025 is to accelerate the procurement of renewable energy globally, directly addressing the largest part of their carbon footprint. In 2024, Amkor Technology achieved an absolute reduction of less than 1% of Scope 1 and 2 GHG emissions from the 2022 base year, so they defintely have a lot of work to do to hit that 55% goal. One clean action item: increase renewable energy procurement in 2025.
Water and energy consumption management is a key operational challenge in Asian fabs.
The semiconductor packaging and test business is inherently water- and energy-intensive, and managing these resources is a critical operational and financial risk, especially in water-stressed regions of Asia where many fabs are located. Amkor Technology is targeting a 20% reduction in water usage intensity by 2030 from its 2018-2020 base period average.
The company made good progress on water conservation in 2024, achieving a 17% decrease in water intensity level from the base period. The combined water recycling rate across all facilities was 22%. In Asia, the challenge is clear: the China site's total water withdrawal in 2024 was 1,873,200 m³, though they managed a 51% recycling rate at that location. This shows the scale of water management required in their largest Asian manufacturing centers.
Here's the quick math on 2024 water usage at a key Asian facility versus a European one:
| Facility Location | Total Water Withdrawal (m³) | Water Recycling Rate |
|---|---|---|
| China Site | 1,873,200 m³ | 51% |
| Portugal Site | 185,097 m³ | 40% |
What this estimate hides is the regional water stress, which is often higher for the China site than the Portugal site, making the high withdrawal volume a greater local risk.
Increased stakeholder demand for sustainable supply chain practices and circular economy initiatives.
The focus has shifted to Scope 3 emissions-those in the value chain-because they represent the hardest part of the decarbonization journey. Amkor Technology has a near-term goal that 80% of its suppliers, by emissions covering purchased goods and services and capital goods, will have science-based targets by 2028. This is a clear action item for their procurement teams.
In 2024, only 25% of suppliers had set these science-based targets, so the company is accelerating its engagement. For instance, in April 2025, Amkor Technology hosted a supplier workshop at Amkor Korea (K5) to help approximately 80 suppliers of semiconductor materials start setting their own SBTs. Also, the company partnered with Infineon in July 2024, signing a Memorandum of Understanding to stimulate joint decarbonization and sustainability strategies across their shared supply chain.
On the circular economy front, the focus is on waste. The target is a 20% reduction in waste generation intensity by 2030 from the 2018-2020 average. In 2024, both total waste and hazardous waste intensity levels decreased by 3% from the base period.
Compliance with RoHS and REACH directives.
Compliance with global substance restrictions is non-negotiable for a company operating internationally, and Amkor Technology has a clear policy here. They must ensure all packaged products meet the Restriction of Hazardous Substances (RoHS) and other chemical-related regulations to access key markets like the European Union.
The company explicitly confirms compliance with several key directives:
- Comply with EU RoHS 2011/65/EU (Restriction of Hazardous Substances).
- Meet requirements for China RoHS 2 and Korea RoHS.
- Adhere to EU ELV 2000/53/EC (End-of-Life Vehicles) and IEC 62474 (Material Declaration for Products of and for the Electrotechnical Industry).
While the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH) directive isn't named in the same list, the broader commitment to the Responsible Business Alliance (RBA) Code of Conduct and ISO 14001 certification for Environmental Management Systems (EMS) confirms a robust framework for managing all restricted and hazardous substances throughout the manufacturing process and supply chain.
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